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EBD11ED8ABFB-6B中文資料
EBD11ED8ABFB-6B數據手冊規(guī)格書PDF詳情
Description
The EBD11ED8ABFB is 128M words × 72 bits, 2 banks Double Data Rate (DDR) SDRAM unbuffered module, mounted 18 pieces of 512M bits DDR SDRAM sealed in TSOP package. Read and write operations are performed at the cross points of the CK and the /CK. This high-speed data transfer is realized by the 2 bits prefetch-pipelined architecture.
Features
? 184-pin socket type dual in line memory module (DIMM)
- PCB height: 31.75mm
- Lead pitch: 1.27mm
? 2.5V power supply
? Data rate: 333Mbps/266Mbps (max.)
? 2.5 V (SSTL_2 compatible) I/O
? Double Data Rate architecture; two data transfers per clock cycle
? Bi-directional, data strobe (DQS) is transmitted/received with data, to be used in capturing data at the receiver
? Data inputs and outputs are synchronized with DQS
? 4 internal banks for concurrent operation (Component)
? DQS is edge aligned with data for READs; center aligned with data for WRITEs
? Differential clock inputs (CK and /CK)
? DLL aligns DQ and DQS transitions with CK transitions
? Commands entered on each positive CK edge; data referenced to both edges of DQS
? Auto precharge option for each burst access
? Programmable burst length: 2, 4, 8
? Programmable /CAS latency (CL): 2, 2.5
? Refresh cycles: (8192 refresh cycles /64ms)
- 7.8μs maximum average periodic refresh interval
? 2 variations of refresh
- Auto refresh
- Self refresh
EBD11ED8ABFB-6B產品屬性
- 類型
描述
- 型號
EBD11ED8ABFB-6B
- 制造商
ELPIDA
- 制造商全稱
Elpida Memory
- 功能描述
1GB Unbuffered DDR SDRAM DIMM EBD11ED8ABFB(128M words 】 72 bits, 2 Banks)
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
ELPIDA |
23+ |
NA |
39960 |
只做進口原裝,終端工廠免費送樣 |
EBD11ED8ABFB-6B 資料下載更多...
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Datasheet數據表PDF頁碼索引
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Elpida Memory 美光科技股份有限公司
Elpida Memory公司是一家領先的動態(tài)隨機存取存儲器(DRAM)集成電路制造商?,總部位于日本,并在全球范圍內擁有先進的制造設施和技術專長?。 Elpida Memory公司成立于2000年,最初是日本唯一一家生產電腦等動態(tài)隨機存取存儲器(DRAM)的企業(yè)。公司在2004年于東京證券交易所主板上市。然而,由于2008年金融危機的沖擊,公司業(yè)績急劇惡化。最終,公司在2012年申請破產保護,并在2013年被美光(Micron)收購合并?。 Elpida Memory公司在技術上具有世界級的專長,其產品特點包括高密度、高速、低功耗和小型封裝。公司通過其Hiroshima Plant和臺灣合資