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RC28F800C3BD70中文資料
RC28F800C3BD70數(shù)據(jù)手冊規(guī)格書PDF詳情
The 0.25 μm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 μ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball μBGA* packages.
■ Flexible SmartVoltage Technology
- 2.7 V–3.6 V Read/Program/Erase
- 2.7 V or 1.65 V I/O Option Reduces Overall System Power
- 12 V for Fast Production Programming
■ High Performance
- 2.7 V–3.6 V: 90 ns Max Access Time
- 3.0 V–3.6 V: 80 ns Max Access Time
■ Optimized Architecture for Code Plus Data Storage
- Eight 8-Kbyte Blocks, Top or Bottom Locations
- Up to Sixty-Three 64-KB Blocks
- Fast Program Suspend Capability
- Fast Erase Suspend Capability
■ Flexible Block Locking
- Lock/Unlock Any Block
- Full Protection on Power-Up
- WP# Pin for Hardware Block Protection
- VPP = GND Option
- VCC Lockout Voltage
■ Low Power Consumption
- 9 mA Typical Read Power
- 10 μA Typical Standby Power with Automatic Power Savings Feature
■ Extended Temperature Operation
- –40 °C to +85 °C
■ Easy-12 V
- Faster Production Programming
- No Additional System Logic
■ 128-bit Protection Register
- 64-bit Unique Device Identifier
- 64-bit User Programmable OTP Cells
■ Extended Cycling Capability
- Minimum 100,000 Block Erase Cycles
■ Flash Data Integrator Software
- Flash Memory Manager
- System Interrupt Manager
- Supports Parameter Storage, Streaming Data (e.g., voice)
■ Automated Word/Byte Program and Block Erase
- Command User Interface
- Status Registers
■ SRAM-Compatible Write Interface
■ Cross-Compatible Command Support
- Intel Basic Command Set
- Common Flash Interface
■ x 16 for High Performance
- 48-Ball μBGA* Package
- 48-Lead TSOP Package
■ x 8 I/O for Space Savings
- 48-Ball μBGA* Package
- 40-Lead TSOP Package
■ 0.25 μ ETOX? VI Flash Technology
RC28F800C3BD70產(chǎn)品屬性
- 類型
描述
- 型號
RC28F800C3BD70
- 功能描述
IC FLASH 8MBIT 70NS 64BGA
- RoHS
否
- 類別
集成電路(IC) >> 存儲器
- 系列
-
- 標(biāo)準(zhǔn)包裝
576
- 系列
- 格式 -
- 存儲器
閃存
- 存儲器類型
閃存 - NAND
- 存儲容量
512M（64M x 8）
- 速度
-
- 接口
并聯(lián)
- 電源電壓
2.7 V ~ 3.6 V
- 工作溫度
-40°C ~ 85°C
- 封裝/外殼
48-TFSOP（0.724，18.40mm 寬）
- 供應(yīng)商設(shè)備封裝
48-TSOP
- 包裝
托盤
- 其它名稱
497-5040
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
Intel |
23+ |
64-EasyBGA(10x13) |
73390 |
專業(yè)分銷產(chǎn)品!原裝正品!價(jià)格優(yōu)勢! |
|||
Intel |
25+23+ |
64-BGA |
17893 |
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨 |
|||
Intel |
23+ |
64-BGA |
65480 |
||||
INTEL |
0424+0425+0322+ |
BGA |
61 |
原裝現(xiàn)貨價(jià)格優(yōu)勢 |
|||
INTEL |
23+ |
BGA |
61 |
全新原裝正品現(xiàn)貨,支持訂貨 |
|||
INTEL |
0525+ |
FBGA64 |
864 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
|||
INTEL |
24+ |
BGA |
2987 |
絕對全新原裝現(xiàn)貨供應(yīng)! |
|||
INTEL |
BGA |
68500 |
一級代理 原裝正品假一罰十價(jià)格優(yōu)勢長期供貨 |
||||
INTEL |
2023+ |
3000 |
進(jìn)口原裝現(xiàn)貨 |
||||
INTEL |
23+ |
BGA |
8890 |
價(jià)格優(yōu)勢/原裝現(xiàn)貨/客戶至上/歡迎廣大客戶來電查詢 |
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INTEL相關(guān)芯片制造商
Datasheet數(shù)據(jù)表PDF頁碼索引
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Intel Corporation
中文資料: 15397條
英特爾（Intel）是美國一家主要以研制CPU處理器的公司，是全球最大的個(gè)人計(jì)算機(jī)零件和CPU制造商，它成立于1968年，具有48年產(chǎn)品創(chuàng)新和市場領(lǐng)導(dǎo)的歷史。 1971年，英特爾推出了全球第一個(gè)微處理器。微處理器所帶來的計(jì)算機(jī)和互聯(lián)網(wǎng)革命，改變了整個(gè)世界。在2016年世界五百強(qiáng)中排在第51位。2014年2月19日，英特爾推出處理器至強(qiáng)E7v2系列采用了多達(dá)15個(gè)處理器核心，成為英特爾核心數(shù)最多的處理器。2014年3月5日，Intel收購智能手表BasisHealthTrackerWatch的制造商BasisScience。2014年8月14日，英特爾6.5億美元收購Avago旗下公司網(wǎng)絡(luò)業(yè)務(wù)。
