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Description

The IRF6644 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80.

? Lead and Bromide Free ①

? Low Profile (<0.7 mm)

? Dual Sided Cooling Compatible ①

? Ultra Low Package Inductance

? Optimized for High Frequency Switching ①

? Ideal for High Performance Isolated Converter Primary Switch Socket

? Optimized for Synchronous Rectification

? Low Conduction Losses

? Compatible with existing Surface Mount Techniques ①