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Features

? Voltage Range: 1.65 V - 3.6 V

? 32-Mbit Flash Memory

? Serial Peripheral Interface (SPI) compatible

? Supports SPI modes 0 and 3

? Supports single input/output operations(1-1-1)

? Supports dual output operations (1-1-2)

? Supports quad output operations (1-1-4)

? Supports quad I/O operations (1-4-4)

? Supports XiP operations (1-4-4, 0-4-4)

? 133 MHz maximum operating frequency

? Clock-to-output of 8 ns

? Flexible, optimized erase architecture for code and data storage applications

? Uniform 4-kByte block erase

? Uniform 32-kByte block erase

? Uniform 64-kByte block erase

? Full chip erase

? Flexible non-volatile block protection

? 1 x 128-byte factory-programmed unique identifier

? 3 x 128-byte, One Time Programmable (OTP) security registers

? Flexible programming

? Byte/Page program (1 to 256 Bytes)

? Sequential program mode capability

? Erase program suspend resume

? Software controlled Reset and Terminate commands

? Hardware reset option (through HOLD pin)

? JEDEC hardware reset

? Non-volatile status register configuration option

? JEDEC standard manufacturer and device ID read methodology

? Serial Flash Discoverable Parameters (SFDP) version 1.6

? Low power dissipation:

? 26 μA standby current (typical)

? 7 μA Deep Power-Down (DPD) current (typical)

? 5 - 7 nA Ultra-Deep Power-Down (UDPD) current (typical)

? 8.3 mA active read current (1-1-1 — 104 MHz)

? 9.2 mA program current

? 10.2 mA erase current

? User-configurable and auto I/O pin drive levels

? Endurance: 100,000 program/erase cycles

? Data Retention: 20 years

? Temperature Range: -40 oC to +85 oC

? Industry standard green (Pb/Halide-free/RoHS Compliant) Package Options

? 8-lead SOIC (150-mil)

? 8-lead SOIC (208-mil)

? 8-pad Ultra-thin DFN (5 x 6 x 0.6 mm)

? 8-pad Ultra-thin Small Outline No-lead USON (3 x 4 x 0.55 mm)

? 12-ball WLCSP (3 x 2 x 3 ball matrix)

? Die in Wafer Form (DWF)