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HD64F2633TE25中文資料
HD64F2633TE25數(shù)據(jù)手冊(cè)規(guī)格書(shū)PDF詳情
Overview
The H8S/2633 Group is a series of microcomputers (MCUs: microcomputer units), built around the H8S/2600 CPU, employing Renesas’ proprietary architecture, and equipped with peripheral functions on-chip.
The H8S/2600 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series.
On-chip peripheral functions required for system configuration include DMA controller (DMAC)*2, data transfer controller (DTC)*2 bus masters, ROM and RAM memory, a 16-bit timer-pulse unit (TPU), programmable pulse generator (PPG)*2, 8-bit timer*2, 14-bit PWM timer (PWM)*2, watchdog timer (WDT), serial communication interface (SCI, IrDA*2), A/D converter, D/A converter*2, and I/O ports. It is also possible to incorporate an on-chip PC bus interface (IIC)*2 as an option.
On-chip ROM is available as 256-kbyte flash memory (F-ZTAT? version)*1 or as 256-, 128-, or 64-kbyte mask ROM. ROM is connected to the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching has been speeded up, and processing speed increased.
Four operating modes, modes 4 to 7, are provided, and there is a choice of single-chip mode or external expansion mode.
The features of the H8S/2633 Group are shown in table 1.1.
HD64F2633TE25產(chǎn)品屬性
- 類(lèi)型
描述
- 型號(hào)
HD64F2633TE25
- 制造商
Renesas Electronics
- 功能描述
H8S 25MHz Cut Tape
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Renesas(瑞薩) |
24+ |
標(biāo)準(zhǔn)封裝 |
7161 |
支持大陸交貨,美金交易。原裝現(xiàn)貨庫(kù)存。 |
|||
RENESAS/瑞薩 |
25+ |
TQFP128 |
32360 |
RENESAS/瑞薩全新特價(jià)HD64F2633TE25(V)/DF2633TE25V即刻詢(xún)購(gòu)立享優(yōu)惠 |
|||
RENESAS |
2014+ |
1 |
公司現(xiàn)貨庫(kù)存 |
||||
RENESAS |
23+ |
65480 |
|||||
RENESAS |
16+ |
QFP |
8800 |
進(jìn)口原裝大量現(xiàn)貨熱賣(mài)中 |
|||
RENESAS |
24+ |
QFP |
3000 |
進(jìn)口原裝正品優(yōu)勢(shì)供應(yīng) |
|||
RENESAS |
2023+ |
QFP |
5800 |
進(jìn)口原裝,現(xiàn)貨熱賣(mài) |
|||
RENESAS |
2023+ |
QFP |
9330 |
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨 |
|||
RENESAS |
23+ |
QFP |
8000 |
只做原裝現(xiàn)貨 |
|||
RENESAS |
23+ |
QFP |
7000 |
HD64F2633TE25 資料下載更多...
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Datasheet數(shù)據(jù)表PDF頁(yè)碼索引
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Renesas Technology Corp 瑞薩科技有限公司
瑞薩科技公司(Renesas Technology Corp.)是一家全球領(lǐng)先的半導(dǎo)體解決方案供應(yīng)商,總部位于日本東京。公司成立于2002年,由原日立半導(dǎo)體和三菱電機(jī)半導(dǎo)體合并而成,專(zhuān)注于提供高性能和高效能的微控制器、模擬和混合信號(hào)IC、功率半導(dǎo)體以及系統(tǒng)集成解決方案,廣泛應(yīng)用于汽車(chē)、工業(yè)控制、信息通信、消費(fèi)電子等多個(gè)領(lǐng)域。瑞薩科技的產(chǎn)品組合涵蓋微控制器(MCUs)、模擬和混合信號(hào)IC、功率半導(dǎo)體以及汽車(chē)解決方案等。公司在汽車(chē)電子領(lǐng)域具有強(qiáng)大的技術(shù)實(shí)力,提供車(chē)載MCU、傳感器和網(wǎng)絡(luò)解決方案,支持智能汽車(chē)的發(fā)展。瑞薩在全球設(shè)有多個(gè)研發(fā)中心和分支機(jī)構(gòu),產(chǎn)品及解決方案銷(xiāo)售至歐美、亞洲等地區(qū),致力于為